The trainers will present the training content by cell phone jammers .The technical report of cell phone jammers contains all technical parameters
Developed countries in order to occupy the commanding heights of the world's IT environment of global competition, to win the initiative, have to step up the implementation of the development plan of the laser industry, such as the U.S. laser fusion program, the German Laser 2001 Plan of Action, United Kingdom, "A Virgin plans, Japan to start laser Five-Year Plan ". The implementation of these projects, the effective promotion of the global laser industry has entered a stage of rapid development. Laser processing for re-manufacturing and applied to other manufacturing, irreplaceable advantages, and better than other processing techniques. The lecturers may be stuck in such an embarrassment without cell phone jammers .
Laser processing for re-manufacturing is the transformation hardening to the laser surface alloying and laser cladding by laser alloy coating to the composite coating and ceramic coating, which makes the laser surface processing technology to become a re-manufactured important tool. It is mainly 5KW ~ 10KWCO2 high-power laser systems. Compared with the laser processing system, the gap of China's laser processing systems is very large, only about 4 percent of global sales. Mainly as follows: high-end laser processing system little or nothing; the main laser, but off; fine laser processing equipment gap; production and processing enterprises in these areas, China is gathering strength, steadily into the domestic application of the market has ample room.
Among them, three electrodes the DBR-LD is the most typical of DBR-LD-based single-mode wavelength tunable semiconductor lasers, the principle structure as shown in Figure 5-3. Figure 5-3 Three-electrode the DBR-LD structure diagram (4) vertical cavity surface emitting laser optical data transmission and exchange of multi-channel often needs to be able to two-dimensional integrated devices, vertical cavity surface emitting laser (VCSEL) is a good choice. And side emitting laser biggest difference is: the incident light perpendicular to the epitaxial surface of the device, that is parallel to the direction of epitaxial growth. Figure 5-4, typical chart on distributed Bragg reflector (DBR) dielectric mirror, intermediate (InGaAsN) for the quantum well active region, the oxide layer help form a good current and optical confinement structure, the current injected by the P, N-electrode, the light issued by the direction of the arrow. laser processing "tool" wear and tear, and the role of "cutting force on the workpiece. (4) laser processing, laser beam energy density, processing speed, and local processing, there is no impact or minimal impact on non-laser irradiated sites.
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